2017 EUVL Materials Readiness for HVM
<p>Jun 20, 2017 03:57 PM</p>
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by Ed korcyznski... Sr Tech Ed. of SemiMD...</p>
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Intel, Samsung, and TSMC will start pilot production using EUV in 2018 !!
ASML... has a backlog of 21 EUV tools !</p>
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source, mask, and resist all are near targets.
mask pellicle needs work and</p>
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actinic metrology for mask inspection... still expensive to solve.</p>
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no way to escape trade-offs of Resolution/ line-width-roughness/ sensitivity triangle</p>
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ASML NXE33x0 steppers have patterned > 1 M wafers.</p>
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backlog of 21 = 2.5 billion dollars.</p>
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cost $22 per wafer pass just for tool depreciation.</p>
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one EUV exposure replaces 4 to 5 ArFi = argon fluoride immersion.</p>
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resist supplier is Inpria...</p>
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