Chris Mack goes deep (UV)
<p>Jan 31, 2013 12:46 PM
 
done on July 23 2013
 
3 separate things
 
EUV
450
and those together.  (2020 at the earliest for BOTH together)
 
could be that EUV does not make it
EUV will be first at 300 mm
 
Intel bot 10% of ASML:
ASML will focus on 300mm EUV.
 
Intel wants to EUV 450 by 2018 for first prototype tools;
 
can do 450 without EUV;
 
Cymer does not care about 450... only abt EUV;
 
ASML has already made 3100... shipped 6 to customers... they are in the field...
but at 5 wafers per hours...  a preversion;
 
ASML  promising  60 wafers per hours by end of 2012
to insert process prob at 14 nm node...
 
production is the 3300 machine:  in 2013  120 wafers per hour
 
will not be used before 2014 but poss by 2015 for manufac...
 
but he does not believe it....  but thru put will not cost-effective
in 2015  at 30 wafers per hour.
 
how can we make money at 14 nm or 10 nm nodes...
we will build it, but nobody will come... no market (cuz cost for transistor will be higher);
cost must be 10% lower or forget it...
 
so may shift emphasis to incr wafer size ...  move to 450
but will it lower the cost?  not sure...
 
intel  at 450... paying for r and d directly;  applied material; KLA Tencor; Novellis are the
r and d companies...  must be the semi manufac  who take the risk... not the suppliers.
 
can u do 450 without EUV... yes  (may do it with 193i multi patterning)
 
does EUV make it possible to extend life of 300?
A:  perhaps only if  can do 10 nm at lower cost...  might reduce pressure
to go to 450...
 
but Chris thinks EUV will be a high cost option.</p>