How Intel and AMD are using 'chiplets' to build next-gen CPUs
<p>April 24, 2019, 7:43 PM from Chris Schott at Engad.</p>
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<p>Computex.... new chips from AMD and Intel later this year.</p>
<p>from Engadget.</p>
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<p>hard to dissipate heat and more errors on a big chip.</p>
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<p>break up the cpu into chiplets.</p>
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<p>make subassemblies separately. Intel struggling for years with 10 nm. Intel 10 nm has 100M xsistor per mm2. combine into multi-chip module. Computex in May... CPU at 7nm and IO at 14 nm in sep. chiplet. Intel will stack these.... longer batterylife Foveros from Intel. stack DRAM ont op of CPU. eg 10 nm Sunny Cove. improved power effic. EMIB embedded multi-die interconnect bridge. can it dissipate heat? will next gety Lakefield... big reveal at Computex. </p>
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<p>l</p>
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