Chris Mack on next-generation lithography and the future of Moore's Law
<p>Jan 31, 2013 12:37 PM
 
works in litho for 30 years...
 
line edge roughness  LER
 
trying to print below 20 nm;
 
193 nm litho with addition of high index water;  193i = immersion
 
next-gen litho
 
EUV most money/ attn, under devl for 20 years.
 
multiple e-beams... decades... but cannot do mass production...
need millions of beams;  unclear whether will be successful.
 
DSA:  direc self assembly;  put them exactly where we want them
say use combo of 193i +  self-assembly;   but defectivity is an issue.
 
need 3 things:  1) quality:  LER, resol, etc  2) cost (must be lower) must be cheaper
3)  timing  (move step by step together) of development.
 
Moore will come to an end  (was orig abt # of xstr on a chip; then size)
mems actuators  memory + cpu on a chip, etc.   but innovation will not stop.</p>